We have access to a large variety of manufacturing technologies which can be offered to our customers. Our process engineers enjoy broad experience in the set up and manufacturing of customized MEMS solutions.

In cooperation with the Fraunhofer IISB and the University Erlangen-Nürnberg the following single step processing tools are available:

100mm / 150mm Wafer Fab Capabilities:

Substrates

Wafers of silicon, SOI (100mm), fused silica (100mm) and glass (100mm)
Experience in handling thin wafers and fragile structures

Lithography

Laser Lithography (high resolution)
Contact 1:1
Minimum features: ~0.8 µm (vacuum contact mode) or ~3 µm (proximity mode)
Alignment accuracy: ~0.5 µm (front side align), or ~2 µm (back side align)
Double-side lithography capabilities
Photoresist coater (Resist thickness: 1-10 µm)
Spray coating (Resist thickness: 1-10 µm)
Positive and negative photoresist
Lift-off

Plasma Etching

DRIE
Polysilicon
Metals (Al, AlSiCu, …)
Oxide ICP

Plasma Deposition

PECVD nitride (LF/HF)
PECVD silicon oxide

Wafer Bonding

Anodic bonding (Alignment accuracy for wafer pairs < 5 µm, all bonding can be done in controlled ambient conditions or vacuum)

Furnace Processes

Wet oxidation
Dry oxidation
Annealing processes
Doping processes (ion implantation)
Low-stress LPCVD nitride
LPCVD oxides
LPCVD polysilicon

Wet Etching

Anisotropic silicon etching (KOH)
Wet etching of dielectrics (i.e. different oxides and nitrides)
Wet cleaning process; acid- and solvent based
Wet etching of metals

Metallization

Sputter deposition (Al, Cr, Ni, Ti, PtIr)
Evaporation (Al, Au, Cr, Ni, Ti, Ag, Pd, Pt, Mo, Cu)

Focused Ion Beam (FIB)

Nano-structuring, cross-section analysis, electronic chip modification

Metrology

SEM (+EDX)
SPM (AFM, TUNA, SSRM, SCM, MFM, EFM, KPM)
Ellipsometer / Spectral ellipsometer
Inspection microscopes
Surface profiler
Sheet resistance (four-point probe)
Optical layer thickness measurement with spectral photometer
Vibration analyzer